稀土Nd对时效过程中SnAgCu无铅焊点组织及性能的影响

摘要电子封装技术的不断发展使人们对钎料的性能要求越来越苛刻，无铅化进程的不断推进使含铅钎料正一步步退出历史舞台，无铅钎料自然而然成为了人们研究的热点之一。SnAgCu系钎料合金性能优秀，可靠性强，是目前最有可能替代SnPb钎料的无铅钎料之一，但SnAgCu系钎料在润湿性能、微焊点长期服役可靠性等方面仍需通过实验进行改进。SnAgCu系钎料Sn含量较高、较高的熔点使得钎料焊点内部金属间化合物的拥有复杂的生长方式和规律。目前最常用的研究方法是通过微量元素合金化的方法向钎料中添加其他组元来改善钎料的性能，本论文通过以Sn3。8Ag0。7Cu无铅钎料为基体钎料，加入不同含量的稀土Nd制备SnAgCu-xNd钎料，以SnAgCu、SnAgCu-xNd为焊接材料，通过再流焊焊接片式电阻元件，研究加入不同成分稀土Nd对等温时效中焊点组织及性能的影响。87872

毕业论文关键词：SnAgCu，无铅钎料，稀土元素，力学性能，显微组织

毕业设计说明书外文摘要

Title Effect of Nd on the microstructure and properties of lead-free solder SnAgCu the aging process

Abstract Constant development of electronic packaging technology allows people to solder performance requirements more demanding and continuously push forward the process of making lead-free solder containing lead are one step from the historical stage, lead-free solder naturally become the people's research focus one。 SnAgCu-based solder alloy excellent performance, reliability, it is the most likely alternative to one of SnPb solder lead-free solder, but for SnAgCu solder wetting performance, micro bumps and other aspects still need long-term service reliability improvement through experiments。 Higher for SnAgCu Solder Sn content, so that has a higher melting point compounds between the solder joints inside the metal complex growth pattern and laws。 The most commonly used methods of trace elements is added by alloying method to other brazing filler component to improve the performance of the solder, this paper by Sn3。8Ag0。7Cu lead-free solder as a matrix solder, adding different contents Preparation of rare earth Nd solder SnAgCu-xNd to SnAgCu, SnAgCu-xNd welding material by reflow soldering chip resistor elements, study the effects of different composition of Nd added isothermal aging in solder microstructure and properties。源-于,优Y尔-论,文.网wwW.yOueRw.com 原文+QQ752018,766

Keywords: SnAgCu, solder, rare earth elements, mechanical properties, microstructure

1 绪论 1

1。1 无铅钎料的研究现状 1

1。1。1 二元系无铅钎料 1

1。1。2 三元系无铅钎料 2

1。2 SnAgCu-X钎料研究现状 2

1。3 SnAgCu-X/Cu焊点组织与力学性能 3

1。3。1 非稀土元素对SnAgCu/Cu焊点组织与性能影响 3

1。3。2稀土元素对SnAgCu/Cu焊点组织与力学性能影响 3

1。4 本论文的研究目的与内容 4

2 试验方法 5

2。1 制备钎料 5

2。2 钎料合金性能测试 6

2。2。1钎料润湿性能测试 6

2。2。2钎料热性能试验 7

2。3 微焊点力学性能试验稀土Nd对时效过程中SnAgCu无铅焊点组织及性能的影响:http://www.youerw.com/cailiao/lunwen_149314.html