各位大哥，
我的 WINCE6。0 升级到 R2 版本后运行一切正常，
当我装上 081231 的补丁后就出现堆栈溢出了，
调试信息如下，
OEMLaunch:Physical Address 0xA0501000(Virtual Address 0x80501000)
Windows CE Kernel for ARM (Thumb Enabled) Built on Nov 24 2008 at 14:58:01
+OEMInit
INFO:OALLogSetZones: dpCurSettings.ulZoneMask: 0xb
OEM: Force clean boot.
-OEMInit
!!! Committed last page of the stack (0xd0230018), SEH bypassed, thread terminated !!!
Exception 'User Stack Overflow' (-3): Thread-Id=00920002(pth=87f95120), Proc-Id=00400002(pprc=827c9308) 'NK.EXE', VM-active=00400002(pprc=827c9308) 'NK.EXE'
PC=c003f4e0(k.coredll.dll+0x0001f4e0) RA=d0040000(???+0xd0040000) SP=d023f860, BVA=d0230018
请高手指点一下，怎么样修改才能解决这问题~！
安装顺序：
1. 安装VS2005
2. 安装Windows Embeded CE 6.0
3. 安装WINCE6 Updata2007
4. 安装WINCE6 SP1
5. 安装WINCE6 R2
6. 安装WINCE6 Updata2008(含WinCEPB60-071231-Product-Update-Rollup-Armv4I.msi)
把最新的补丁都打上就可以了，12月份的那个rollup是有问题的。
Customers must install Windows Embedded CE 6.0 R2 to be able to install updates.
The following must be installed in order to create a supported Windows Embedded CE 6.0 development environment:
1. Visual Studio 2005
2. Visual Studio 2005 SP1
3. Visual Studio 2005 SP1 Update for Vista (if applicable)
4. Windows Embedded CE 6.0 Platform Builder
5. Windows Embedded CE 6.0 SP1 (required if PB 6.0 Tools have been installed)
6. Windows Embedded CE 6.0 R2
7. Windows Embedded CE 6.0 Cumulative Product Update Rollup 12/31/2008(08年前所有补丁