摘要：在原有的基础上对焦磷酸盐-二价锡盐铜锡合金电镀工艺做了进一步的探讨和研究，期望得到外观为金黄色的低锡青铜。利用赫尔槽实验和吊镀实验研究了镀液组成、工艺条件、添加剂和辅助配位剂对电镀铜锡合金的影响，同时通过利用钝化后的样板来测试镀层的性能。通过赫尔槽实验得到最佳的镀液组成和工艺条件为：Cu2P2O7•3H2O  25g/L；Sn2P2O7  5-7g/L；K4P2O7•3H2O  250g/L；pH 8.5-8.8；电流0.3A；温度30-35℃。在此基础上研究了添加剂和辅助配位剂对焦磷酸盐体系电镀铜锡合金的影响，得出聚乙二醇和柠檬酸钾对提升镀层光亮度有一定作用。其次通过吊镀实验验证了此工艺的可行性和实用性。因此最终取得的最佳配方和工艺条件如下：Cu2P2O7•3H2O  25g/L；Sn2P2O7  5-7g/L；K4P2O7•3H2O  250g/L；pH 8.5-8.8；电流密度 0.35A/dm2；温度30-35℃；电镀时间：3min；添加剂：聚乙二醇 0.004g/L；辅助配位剂：柠檬酸钾 6g/L。在这一工艺条件下获得的铜锡合金镀层外观为金黄色，镀层细致且无针孔、气泡等瑕疵，有一定光亮度，与基体结合力良好。在进行钝化后有较好的抗变色能力。19873
关键词： 铜锡合金；焦磷酸盐体系；低锡青铜
Study of the Cu-Sn alloy electroplating process in pyrophosphate - palent tin salts system
Abstract: Doing further research in Cu-Sn alloy electroplating technology by phosphate-palent tin salts system, hoping to get the golden low-tin bronze. Using Hull solt and hang plating experiments to discussed the influence of the plating bath composition , process conditions, additives and auxiliary complexing agent for Cu-Sn alloy. While to test coating capability through the use of a sample after passivation. The best bath composition and operation conditions by Hull solt experiments : Cu2P2O7•3H2O  25g/L；Sn2P2O7  5-7g/L; K4P2O7•3H2O  250g/L; pH 8.5-8.8; electric current 0.3A ; temperature 30-35℃.On the basis of these, effects of additives and auxiliary complexing agent for the pyrophosphate Cu-Sn alloy plating system was also discussed. The result showed that polyethylene glycol and potassium citrate can slightly increase the brightness of the coating after joining .Then through the hang plating experiment to vertify the feasibility and practicability of this system. Therefore the best recipes and experimental conditions are as follows:Cu2P2O7•3H2O  25g/L; Sn2P2O7  5-7g/L; K4P2O7•3H2O  250g/L; pH 8.5-8.8; current density 0.35A/dm2; temperature 30-35℃; electroplating time: 3min; additives: polyethylene glycol 0.004g/L; auxiliary complexing agent: potassium citrate 6g/L. The appearance of Cu-Sn alloy film by this operation conditions was golden. Got delicate coating with no pinholes, bubbles and other defects. There was a certain brightness and good binding force. After the passivation , the coating had good ability of resistance to change color.
Keywords:  Cu-Sn alloy；pyrophosphate system；low-tin bronze
目  录
1前言    1
1.1概况    1
1.2目的与内容    2
1.3主要技术要求    2
1.4国内外的历史及发展趋势    2
1.4.1铜锡合金电镀在国外的发展情况    2
1.4.2铜锡合金电镀在国内的发展情况    3
1.5铜锡合金电镀的体系和应用    3
1.5.1柠檬酸盐电镀铜锡合金工艺    3
1.5.2硫酸盐型电镀铜锡合金工艺    3
1.5.3在聚醚存在下的硫酸盐电镀铜锡合金    4
1.5.4焦磷酸盐体系电镀铜锡合金    4
1.5.5国内外的历史及发展趋势    5
1.5.6山梨糖醇作为络合剂的铜锡合金电镀    5 焦磷酸盐-二价锡盐铜锡合金电镀工艺研究:http://www.youerw.com/huaxue/lunwen_11431.html