毕业论文移动版

摘要电子设备工作时会不可避免的源源不断地附带产生热能，如果没有相应控制温度的措施，系统中电子元器件就会因为过热而导致失效。故此，对电子设备进行应力场与温度场分析就显得非常必要了，ANSYS热分析模块不但可以模拟传导、对流和辐射三种传热方式，而且其丰富的二维、三维热分析单元，为求解不同封装密度的电子器件散热效率提供了方便[3]。本次课题就将利用ANSYS热分析模块对某型摄像头工作时，设备现有布局下其内部的应力场温度场进行分析计算，以获得相关数据优化设备的热设计。本文通过对大型软件ANSYS的开发应用，不仅探索出ANSYS软件用于解决复杂工程问题的方法及应用特点，而且通过具体应用为电子系统的可靠性设计提供重要参考，也为实现电子设备的计算机辅助设计奠定基础。65358

毕业论文关键词   电子封装、热失效、应力场、温度场、ANSYS热分析模块、热设计

毕业设计说明书（论文）外文摘要

Title    Calculation of a camera when working temperature field and stress field Based on ANSYS                                            

Abstract

It will produce heat continuously when electronic equipments work. If we don’t take measures to control the temperature, the electronic components in the system will break down due to the high temperature. Thermal cyclic loading is the main factor to cause the damage of electronic systems and the components Therefore, it is very necessary to analyze the stress field and the temperature field of electronic devices, the module of heat transfer analysis thermal in ANSYS can not only simulate the three ways of heat transfer, such as conduction, convection and radiation, but also take a convenient for solving different packaging density of electronic devices with its rich two-dimensional and three-dimensional thermal analysis unit [3]. The project will use thermal analysis module of ANSYS to analyze the stress field and the temperature field of a type of camera when it works, and obtain the relevant data of optimizing the thermal design of equipment. Based on the exploitation and application of ANSYS, we can figure out the methods and characteristics of application for ANSYS applying for solving complex engineering problems. What’s more, the practical application provides valuable reference for the DFR of electronic systems, which lays a foundation for the realization of computer aided design of electronic equipment.

Keywords： Electronic packaging,     thermal failure,     stress field,   

temperature field,    ANSYS thermal analysis module,     thermal design

目录

第一章 绪论 1

1.1简介 1

1.2电路集成化对电子热设计提出的挑战 1

1.3本课题研究现状及发展趋势 2

1.4本课题研究对象其热量传递过程： 3

第二章 热传导问题的有限元方法 3

2.1热分析方法: 3

2.1.1计算机数值分析与模拟 3

2.1.2本课题研究对象因素 4

2.2热传导问题的有限元方法概述 6

2.3热传导问题数学模型 7

2.4稳态热传导的有限元格式推导 8

第三章 电子系统温度场、应力场数值仿真 (责任编辑：qin)