摘 要本文针对自制功率超声设备制备的BGA焊球进行了形貌、尺寸、均匀度和氧化程度分析，主要试验内容包括：1、采用软件和数学统计方法，对制备的BGA焊球进行圆整度、直径、均匀度进行测试分析；2、利用扫描电镜对小球形貌和金相进行分析，分析冷却介质对小球的表面微观形貌的影响。3通过ICAP等离子发射光谱仪对小球的氧化程度度进行测试和分析，测试不同工艺条件制备小球的氧化程度。87183

研究结果表明：1、通过比较冷却条件的不同下的1mm-1。5mm的小球，得到其经过Image-pro-Plus的数值为1。42、0。98、0。97，截距法数值为1。12、1。02、1。02确定小球的最好的参数的试样为二号样品，分析得出小球制备圆整度较好的实验条件。2、通过分分析对比1mm到1。5mm自制焊球表面微观组织，用以标示小球的焊接强度。3、通过ICAP的离子分析计算小球的氧化程度分别为1。394*10-6、4。38*10-6、1。064*10-6mol氧化率分别为0。34%、1。2%、0。28%。小球的氧化率去除掉较大数值后可以得出其氧化皆以千分计算，证明小球氧化率符合工业标准。

关键词：BGA焊球；氧化性分析；表征检测；

Abstract

This paper based on the homemade power ultrasonic equipment preparation of BGA Solder ball of the analysis of morphology, size, uniformity and the oxidation degree, main research contents include: 1, the use of software and the method of mathematics statistics, the preparation of BGA Solder Ball circle flatness, diameter, uniformity test analysis; 2, pellet morphology and microstructure were analyzed by scanning electron microscope (SEM)。 Analysis the influence of cooling medium on the ball surface micro topography。 3 to test and analyze the degree of oxidation of the ball by ICAP plasma emission spectrometer, and to test the oxidation degree of the pellets prepared by different process conditions。

The results show that: 1, by comparing cooling conditions with different 1mm-1。5mm ball and get the after Image-pro-Plus numerical is 1。42, 0。98, 0。97, intercept method for 1。12, 102, 102 ball to determine the best parameters of the specimen for No。 2 samples, the analysis of small ball by circle flatness better experimental conditions。 2, through the analysis and comparison of 1mm to 1。5mm homemade welding ball surface microstructure, used to mark the ball's welding strength。 3。 The oxidation degree of the small spheres was 1。394*10-6, 4。38*10-6 and 1。064*10-6mol respectively, and the oxidation rates were 0。34%, 1。2% and 0。28%, respectively。 Oxidation rate of the ball to remove larger value can be obtained the oxidation with thousands of calculation that ball oxidation rate is compatible with the industry standard。

Key word:BGA solder； Oxidation analysis；balldetector characterization； 

目录

第一章 绪论 1

1、引言 1

1。1BGA封装简介 1

1。2超声波简介 1

1。3 BGA可靠性 2

1。4 Sn-Bi合金焊球的制备技术 3

1。5国内外研究问题综述 4

1。6无铅焊点及其力学性能的研究 4

第二章 实验设备 6

2。1 Sn-Bi合金的检测设备 6

2。1。1刻度尺和Image-Pro-Plus软件 6

2。1。2扫描电子显微镜 6

2。1。3  DSC差热分析 6