聚酰亚胺涂层胶的制备与性能
毕业论文关键词：聚酰亚胺; 胶黏剂; 附着力; PI覆铝板
Title Preparation and properties of polyimide coatings
Abstract Polyimide(PI) is a aromatic heterocyclic polymer developed by DuPont in United States in the early 1960 of the 20th century which have the ability of excellent hydrolysis and salt spray resistance. Polyimide materials property features excellent fuel, oils and organic solvents, and high temperature resistant, acid-resistant characters, which is the excellent heat-resistant electric insulating materials. Properties of polyimide materials also has outstanding radiation resistance (neutrons and electrons), and can be used as structural adhesives, bonding metals such as stainless steel, copper, aluminium and alloys, consistent with the micro-electronics industry (printed circuit board), aviation, aerospace, industrial adhesive requirements. In this paper, BTDA, PMDA and ODA diamine mixed anhydride , was prepared by a conventional imidization polyimide coating adhesive.By means of infrared spectroscopy (FTIR), thermal gravimetric analysis (TG), universal electronic tensile testing machine and the adhesion ,the system dianhydride proportion , preparation for glue coating properties and formation layer performance was studied. The results show that: the tensile strength increase with the the amount of BTDA, witch increases first and then decrease. When PMDA:BTDA is 40:60, the tensile strength of polyimide film reaches the maximum; the decomposition temperature of PI were relatively high, more than 516 ℃, which shows good heat resistance. When BTDA:PMDA is 40:60, the highest thermal stability, temperature come up to 596.94 ℃ thermal decomposition of PI, it reached the maximum decomposition rate at 599.61 ℃, when the ratio of BTDA increased when the temperature decreases, the thermal decomposition of PI; with the decrease of PMDA content,the content of BTDA increase, the adhesion of PI is greatly enhanced.when BTDA:PMDA is 80:20,PI achieves the best adhesion, 0; After immersion corrosion 72h of strong adhesion of PI films on aluminum, the strength of adhesion have been greatly decreased. For aluminum, PI in which PMDA:BTDA=20:80 and 25:75 coating adhesive can maintain good performance, grade of 0 and 1. When BTDA:PMDA is 80:20 ,synthesis of polyimide can meet the performance requirements of us.