摘要电子产品能够广泛应用的关键问题是表面封装技术焊点的可靠性问题。本文 针对 CBGA 器件，从不同的焊点材料和不同的焊点尺寸对焊点的可靠性影响的方 面进行了系统的研究。

通过有限元模拟软件 ANSYS 15。0,对简化了的 CBGA 器件的三维模型的焊点 的应力应变进行了限元分析。73979

通过研究不同焊点材料(SnAgCu、5Sn95Pb、60Sn40Pb)构成的 CBGA 器件, 利 用有限元模拟陶瓷球栅阵列器件在温度循环加载条件下的应力应变分布,得到焊 点的应力和蠕变分布图及其对应的曲线图,得出以 60Sn40Pb 为焊点材料的 CBGA 器件其可靠性最好,表明适量的添加铅有利于提高 CBGA 器件的可靠性。

通过研究不同焊点尺寸(0。3mm、0。35mm)构成的 CBGA 器件, 采用有限元模拟 的方式，对陶瓷球栅阵列器件在温度循环加载条件下的应力应变分布进行分析, 得到焊点的应力和蠕变分布图及其对应的曲线图,得出以 0。3mm 为焊点尺寸的 CBGA 器件的可靠性最好,表明有限元分析法用于微电子封装技术可靠性的研究 中，可以有效的提高工作的效率，节约成本。

该论文有图 27 幅，表 7 个，参考文献 55 篇。

毕业论文关键词：陶瓷球栅阵列 有限元分析 应力 蠕变

CBGA device structure optimization design

Abstract Electronics is the key problem of surface encapsulation technology can widely used in the solder joints reliability problems。 In this paper,

For CBGA components from different solder materials and different solder joint size effect on the reliability of solder joints has carried on the system research。

Through the finite element simulation software ANSYS 15。0, the simplified three-dimensional model of CBGA components of limited element analysis the stress and strain of solder joint。

By studying the different solder material (SnAgCu, 5Sn95Pb, 60Sn40Pb) consisting of CBGA components, using the finite element simulation of ceramic ball grid array device in temperature stress and strain distribution of cyclic loading conditions, the stress and creep of the solder joint distribution and its corresponding graph, concluded with the solder joint materials of 60Sn40Pb CBGA device reliability is best, suggests that the right amount of adding lead to improve the reliability of CBGA components。

By studying the different spot size (0。3mm and 0。35mm) of CBGA components, with the method of finite element simulation, the temperature cyclic loading  of ceramic ball grid array device in under the condition of stress and strain distribution were analyzed, and the stress and creep of the solder joint distribution and its corresponding graph, reach to 0。3mm for the reliability of CBGA components of solder joint size is best, show that the reliability of the finite element analysis method is used for microelectronics packaging technology in the study, can  effectively improve the work efficiency, cost savings。

The paper has 27 pictures and 7 tables and 55 references。

Key Words: CBGA Finite Element Analysis Stress Creep

目 录

摘要-Ⅰ

Abstract--Ⅱ

目录-Ⅲ

图清单-Ⅳ

表清单-Ⅴ

1  绪论 1

1。1 陶瓷焊球阵列封装技术的发展 1

1。2 CBGA 器件国内外发展现状 4

1。3 CBGA 器件可靠性研究的国内外研究现状 5

1。4  本文的研究方法及主要工作