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摘  要

随着微电子技术的发展，电子元器件的散热已经成为一大焦点问题。均温板以其高的热导率和良好的均温性，成为解决电子散热问题很有前景的技术之一。均温板内部的液体工质蒸发吸收热源的热量，到达冷凝面液化放出热量，再通过均温板内部毛细芯结构的毛细作用回到蒸发面，由此将电子器件运行时所产生的热量迅速均匀地分散开，降低电子器件周围的温度。目前对于均温板的研究还有待深入，一方面是因为电子器件朝高性能、微小化的趋势发展，对散热的要求更高；另一方面是因为均温板本身在性能方面还有很大的提升空间。

本文以沟槽式均温板为研究对象，设计出4块沟槽数、深宽比不同的均温板。借鉴相关企业先进的制造加工方法，完成均温板的制作；设计均温板性能测试实验并搭建实验平台，主要由实验台架系统、电加热热源系统、冷却水路系统、数据采集系统、均温板固定装置等部分组成，利用该系统完成对均温板的性能测试。根据实验所测数据，比较了4块均温板的轴向热阻、扩散热阻以及启动性能，据此分析内部毛细芯结构以及充注量对均温板性能的影响。

有关均温板的很多问题还值得探讨研究，本课题开展了实验对沟槽式均温板的性能进行研究，根据所得结论对后续均温板的设计工作提出建议。

关键词：均温板；热阻；性能测试

Abstract

With the development of microelectronic technology, the cooling of the electronic components has become one of the hot pots. Because of the high thermal conductivity and good thermal homogeneity, vapor chamber is one of the available technology to deal with the high density electronic cooling problem. Liquid working media in the vapor chamber evaporates and absorbs heat from heat source. Then it liquefies and gives out heat on condensing surface. Due to the capillary effect of the capillary structure, liquid working media returns to evaporating surface. Thus the heat generated by the target electronics can be effectively diffused, and the temperature of electronic devices is lower. More research about vapor chamber are needed. On the one hand miniaturization is the main trend in the development of electronic devices, users require higher performance on the heat dissipation capability. On the other hand, the technological efficiency of the vapor chamber has very big upgrade space.

In this item, we study vapor chamber and four different kinds of vapor chamber is designed. We finish the vapor chamber production and packagin based on the advanced processing methods of enterprises. The experimental platform is established according to the designing experiment scheme, which contains test bench, heat source syste, cooling system, data acquisition system, fixing device etc. Performance testing about vapor chamber is fulfilled. The axial thermal resistance, spreading resistance and startup performance of four different kinds of vapor chamber are compared according to the experimental data. The effect of the internal wick structure and liquid filling ratio on operation performance of vapor chamber are analyzed.

Many problems about vapor chamber still deserve further research and exploration. The aim of this thesis is experimental studies on operation performance of vapor chamber. At last, we put forward some advices about the design of vapor chamber according to the conclusions.

Keywords: Vapor chamber, Thermal resistance, Performance testing 

目 录

第一章 绪论 1

1.1 研究背景 1

1.2 均温板的工作原理 2

1.3 均温板的研究进展 4

1.3.1 实验研究进展 (责任编辑：qin)