摘要发光二极管（LED）作为新型的绿色照明光源，具有节能、高效、低碳、体积小、反应快、抗震性强等优点，可以为用户提供环保、稳定、高效和安全的全新照明体验，已经逐步发展成为成熟的半导体照明产业。而倒装LED由于他的散热性能与方便集成的特性在LED市场中扮演着重要的角色。分析倒装集成LED也是迫在眉睫。在倒装集成LED芯片制造和封装过程中，除了要处理好稳定可靠的电连接以外，还需要处理光的问题。本文先是研究了三种不同封装形式的LED光源光电性能的对比。然后就电流对倒装LED光源的光电性能的影响做了主要研究。并对研究过程中产生的问题，即散热对光电性能的影响做了主要分析。倒装集成LED的光电性能与电流以及随着电流上升的芯片温度密切相关。36002
毕业论文关键词：倒装LED，集成光源，光电性能
Flip chip integrated LED light source photoelectric performance study
AbstractLight-emitting diode (LED) as a new type of green lighting light source, energy saving, high efficiency, low carbon, the advantages of small volume, fast response, strong vibration resistance, can provide users with environmental protection, stable, efficient and safe new lighting experience, has gradually developed into a mature semiconductor lighting industry. And flip chip LED due to the nature of his heat dissipation performance and convenient integration plays an important role in the LED market. Analysis of flip chip integrated LED is imminent. In the flip chip integrated LED chip manufacturing and packaging process, in addition to deal with stable and reliable electrical connection, you also need to deal with the issue of light. This paper first studied the three different encapsulation of LED light source in the form of photoelectric performance comparison. Then current effect the performance of the inversion of the LED light source photoelectric did the research. And the problems in the process of research, namely heat made mainly analyzes the influence of the optical performance. Flip chip integrated LED photoelectric performance and current and closely related with the current rise of chip temperature.
KeyWords：Flip chip LED, Integrated light source photoelectric performance
目录    1
目录...2
第一章 绪论    ...5
1.1 课题背景    5
1.2 倒装LED技术的发展及现状    5
第二章 LED的封装形式    8
2.1三种封装形式    8
2.1.1正装LED    8
2.1.2垂直LED    8
2.1.3倒装LED    10
2.2倒装芯片的优势.10
2.3不同封装形式对比实验    11
2.3.1实验目的    11
2.3.2实验原理    11
2.3.3测试方法    11
2.3.4结果与讨论    11
2.3.5色温测试    14
2.4 结论    14
第三章  倒装集成LED    14
3.1倒装LED的制备工艺    14
3.1.1蓝宝石衬底和GaN外延工艺技术    15
3.1.2倒装LED圆片制程工艺    15
3.1.3倒装LED芯片后段制程    16
3.2 倒装LED的集成方式    16
3.2.1 贴片灯珠    16
3.2.2COB封装    17
3.2.3 贴片灯珠    17
3.3 倒装集成LED的光学特性    18
3.3.1 发光法向光强及其角分布    18
3.3.2 发光峰值波长及其光谱分布    18
3.3.3光通量    19
3.3.4发光效率和视觉灵敏度    19
3.3.5光通量    20
3.3.6发光效率和视觉灵敏度    21 倒装集成LED光源光电性能研究:http://www.youerw.com/tongxin/lunwen_34265.html