大功率电子设备喷雾冷却技术研究
在本文对应的设计和实验中，以接通稳压电源的加热表面为热源，模拟大功率电子设备，设计喷雾冷却腔，对其进行喷雾散热，以R134a为制冷工质，设计喷雾冷却循环并搭建试验台。增加加热面的功率，同时调整制冷工质的进口温度、压力和流量，稳定加热表面的温度在预定范围，得到换热面的热流密度，不断增加功率，得到临界热流密度和最大散热能力。同时研究功率、进口温度、进口压力和流量等参数之间的关联以及对制冷效果的影响。
关键词 喷雾冷却 热流密度 临界热流密度 循环喷雾冷却系统 参数影响
毕业论文设计说明书外文摘要
Title spray cooling technical research of high-power electronic equipments
Abstract
With the fast development of technology, electronic equipments tend to be diminutive ,miniature and integrated ,therefore ,the power and thermal dissipation of electronic equipments continue to increase so that traditional thermal control technologies (such as natural convection ,forced convection and heat pipe cooling methods)have limited removal capabilities for high power and high heat fluxes. For this reason, it is necessary to press for a new and efficient cooling technology. Spray
cooling has received much attention of researchers and been widely studied for its high heat capacity of the cooling process temperature is small，the advantages of small refrigerant. Spray cooling heat transfer mechanism is very complex because of its impact are many factors，is still a need for more theoretical and experimental study．
In this paper, the surface connecting power source is the heat surface, simulated as electronic equipments with high power. In this paper, experimental investigations on heat transfer in spray cooling with R134a were conducted. Increase the power of heat surface, at the same time, adjust the inlet temperature, pressure and rate of flow of refrigerant, and keep the temperature of heat surface at a predetermined range. So, we can get the critical heat flux. Besides, what we need to do is that studying the mutual relation among power, inlet temperature, inlet pressure, rate of flow as well as their influence on cooling effect.
Keywords spray cooling; characteristics of spraying; heat flux; critical heat flux; spray cooling system; parameter influence.
目录
1 绪论 1
1.1 研究背景 1
1.2 电子元件的喷雾冷却技术 1
1.3 国内外研究现状 4
1.4 本文的研究目的和工作任务 5
2 实验系统 5
2.1 系统的设计要求 5
2.2 实验系统的总体设计及其基本流程 6
2.2.1 系统总体设计 6
2.2.2 系统工作流程 6