摘要随着现代工业的快速发展，含铜废水排放量越来越大，严重危害自然环境和人类的健康。本文以壳聚糖为功能单体，硅胶为载体，铜离子为模板离子，γ-（2 -3环氧丙氧)丙基三甲氧基硅烷（KH-560）为偶联剂，利用溶胶-凝胶法和表面离子印迹技术合成了一种新型铜离子印迹多孔材料，用于含铜废水的吸附处理；采用静态吸附法考察了吸附体系pH、吸附剂用量、静置吸附时间对吸附性能的影响。87175

论文采用单因素分析法确定了合成印迹多孔材料制备工艺条件：2。2 g壳聚糖，4 m mol铜离子，19 mL的偶联剂，印迹反应时间为6 h。采用静态吸附法考察印迹多孔材料对铜离子吸附性能的影响，实验表明吸附体系pH为5、印迹多孔材料吸附剂用量为0。4 g、静置吸附时间为5 h，吸附性能表现最佳，吸附率达到83%。在混合液体中，铜离子印迹多孔材料表现出较高的特异选择性吸附，对铜离子的吸附率达到80%，而对其它四种重金属离子的吸附率很低，均低于30%。饱和吸附容量实验中，印迹多孔材料和非印迹材料的吸附容量分别为36。3 mg/g和16。7 mg/g，印迹多孔材料的饱和吸附容量是非印迹材料的2。2倍。通过扫描电镜对印迹多孔材料的表征，发现材料表面大量的印迹空穴的形状、尺寸、官能团与铜离子相匹配，对印迹离子的识别性较高，表现出了较高的特异吸附性，同时对铜离子的饱和吸附容量也很大。

毕业论文关键词：印迹技术；多孔材料；吸附性；印迹空穴

Abstract With the rapid development of modern industry, containing copper wastewater emissions is more and more big, serious harm to natural environment and human health。 This paper with chitosan as the functional monomer, silica gel as carrier, copper ion ion as a template, gamma (2 - 3 epoxy propane oxygen) propyl trimethoxy silane (KH-560) as coupling agent, by Sol - gel method and surface ion imprinting technology synthesized a new copper ion imprinted porous materials, for the adsorption of copper wastewater treatment; by static adsorption method was used to investigate the adsorption of pH, adsorbent dosage, standing adsorption time on the adsorption properties。

The analysis method for the synthesis of molecularly imprinted porous materials preparation process conditions were determined by the single factor: 2。2 g chitosan, 4 m mol 19 mL copper ions, coupling agent, imprinting reaction time is 6 h。 by static adsorption method to study effects of imprinted porous materials on the adsorption properties of copper ion, adsorption experiments show that the system pH is 5 porous materials, imprinted adsorbent dosage is 0。4 g, the static adsorption time is 5 h, the best performance of adsorption, the adsorption rate reached 83%。 in the mixed liquid, the copper ion imprinted porous materials exhibit high selective adsorption, adsorption of copper ion adsorption rate reached 80%, while for the other four kinds of heavy metal ions the rate is very low, were lower than the 30%。 saturated adsorption experiment, adsorption capacity of the imprinted porous materials and non imprinted materials were 36。3 mg/g and 16。7 mg/g, imprinted porous material saturated adsorption capacity is 2。2 times higher than the non imprinted materials by。 Characterization of the imprinted porous materials under the scanning electron microscope found material surface imprinting hole shape, size, functional groups and copper ion to match, and higher recognition of ion imprinting, showed high specific adsorption, also of copper ion saturation adsorption capacity is also a great。

Key words: imprinting technology; porous materials; adsorption; imprinted hole

目 录

第一章 绪论 1

1。1分子（离子）印迹技术 铜离子印迹多孔材料制备及性能研究:http://www.youerw.com/cailiao/lunwen_127794.html