聚酰亚胺二层挠性覆铜板的制备与应用

摘要本论文选取BPDA、BTDA、p-PDA和ODA为原料，按照二胺和二酐不同的摩尔比合成一系列BPDA-BTDA-p-PDA-ODA型PI前躯体聚酰胺酸（PAA），再通过热亚胺化制备了PI薄膜和PI柔性覆铜板。通过红外光谱(FTIR)、热失重分析(TG)和万能电子拉伸机等方法表征了PAA及PI薄膜的结构、热性能、溶解性、力学性能及其应用于两层柔性覆铜板(2L-FCCL)时的剥离强度和尺寸稳定性等性能。6133
结果表明：共聚BPDA-BTDA-p-PDA-ODA型PI的热稳定性好，在氮气氛围中，起始分解温度均超过520℃，显示出良好的热塑性，拉伸强度可高达78.02MPa，剥离强度高达1.72kgf/cm，并且所制备柔性覆铜板的尺寸稳定性也符合工业标准。
关键词聚酰亚胺；热塑性；两层柔性覆铜板
毕业设计说明书（论文）外文摘要
Title The preparation and application of Polyimide resin and cast-on-copper laminate
Abstract
A series of BPDA-BTDA-p-PDA-ODA copolyamide acids with different composition were prepared in this paper. Polyimide film and two layer PI flexible copper clad laminate(2L-FCCL) were obtained via the conventional two-step thermal process. The mechanical property, morphology, thermal property, dimentionally-stable property and peel strength of PI film and FCCL material were characterized by Fourier transform infrared spectroscopy(FTIR), thermogravimetric(TG), universal testing machine and the test of weld temperature resistance etc.
The results showes that: BPDA-BTDA-p-PDA-ODA copolyimide had good thermal stability. Their initial decomposition temperature are all over 520° C in the nitrogen atmosphere. And the results also showes the BPDA-BTDA-p-PDA-ODA copolyimide has good thermoplastic. tensile strength of 78.02MPa, peer strength of 1.72kgf/cm.Moreover the dimensional stability of the preparation of flexible copper clad laminate need to be further improved.
Keywords Polyimide; thermoplasticity; two layer-flexible copper clad laminate
目录
1 绪论   1
1.1 聚酰亚胺简介   1
1.2 挠性覆铜板简介   1
1.3 二层挠性覆铜板   1
1.3.1 二层挠性覆铜板的制备方法   1
1.3.2 二层挠性覆铜板的性能特点   1
1.4 2L-FCCL用聚酰亚胺胶体   2
1.4.1 全芳香型聚酰亚胺   3
1.4.2 酮醚型聚酰亚胺   3
1.4.3 双酚A型聚酰亚胺   4
1.4.4 芳香酯型聚酰亚胺   4
1.4.5 混合改性型聚酰亚胺   5
1.4.6 聚酰亚胺应用于柔性覆铜板的发展趋势   5
1.5 本课题的主要目标及研究方向   6
2 实验部   8
2.1 实验原料及仪器   8
2.2 PI的制备   9
2.3 性能测试   10
2.3.1 红外光谱分析(FTIR)   10
2.3.2 PI溶解性能的测试   10
2.3.3 PI的热失重测试(TG)   10
2.3.4 PI的力学性能测试   10
2.3.5 柔性覆铜板的剥离强度测试   10
2.3.6 柔性覆铜板的尺寸稳定性测试   10
3 结果与讨论   10
3.1 PI的合成路线   10
3.2 柔性覆铜板的剥离强度   11
3.3 PI柔性覆铜板的尺寸变化率（机器方向）   12
3.4 PAA和PI薄膜的红外光谱图   12
3.5 PI薄膜的溶解性能   13
3.6 PI薄膜的热稳定性   14
3.7 PI薄膜的力学性能   15
结论   18
致谢   19
参考文献   20
1 绪论聚酰亚胺二层挠性覆铜板的制备与应用:http://www.youerw.com/cailiao/lunwen_3498.html