摘要本文采用快速凝固法和传统熔炼工艺制备出相同成分的CuPSnNi晶态钎料和非晶态钎料，分别采用DTA，SEM，超景深等现代化手段测试分析，对比分析晶态钎料和非晶态钎料的结晶区间，非晶钎料和晶态钎料的润湿性能受到加热温度的影响。观察润湿界面结构图。实验结果表明：由于非晶钎料的成分扩散均匀，不存在偏析，使它的熔点比晶态钎料约低3。14℃，结晶区间缩小3。7℃。非晶态钎料在润湿性，延展性能，等方面都要优于晶态钎料。随着钎料加热温度增加，两种钎料的润湿速度都出现了先增后减的情况，到680℃时，润湿面积达到最大。非晶钎料润湿的界面中，呈蜂窝状，偏析较小。而晶态钎料的润湿界面中，有较大偏析。86383

毕业论文关键词：快速凝固；Cu-P非晶钎料；润湿性；界面结构；

Abstract Rapid solidification method and traditional smelting process was prepared with the same composition of CuPSnNi amorphous filler metal and amorphous solder used in this paper, using DTA, SEM, test and analysis of modern means of super depth, comparative analysis of amorphous filler metal and amorphous solder melting properties, amorphous filler metal and amorphous filler metal wetting properties affected by the heating temperature。 To observe the structure of wetting interface。 The experimental results show that the amorphous solder composition spread evenly, there is no segregation, which is about 3。14℃ lower than the melting point of crystalline solder, crystallization interval narrowing 3。7℃。 The ductility of amorphous solder on the wettability, and is superior to the amorphous filler metal and so on。 With the increase of heating temperature of solder two kinds of solder, the wetting speed appeared first increased and then decreased, reached 680℃, the maximum wetting area。 The amorphous solder wetting interface, honeycomb, segregation and amorphous filler metal is minimal。 In the wetting interface, there is a large segregation。

Key words: Rapid solidification; Cu-P amorphous alloy; wettability; Interface structure;

目录

第一章  绪论 1

1。1 立题背景及意义 1

1。2 非晶态钎料和钎焊国内外发展动态 2

1。2。1 概述 2

1。2。2 非晶态钎料的分类 3

1。3 Cu-P钎料的研究现状和发展 5

1。3。1 传统铜磷钎料的研究情况 5

1。3。2 非晶铜磷钎料的研究现状 6

1。4 真空钎焊 7

1。4。1 真空钎焊技术的优缺点 8

1。4。2 真空钎焊工艺参数的要求 8

1。5 本文主要研究方面 9

第二章  实验材料设备及方法 10

2。1 实验所需材料及器材 10

2。2 钎料润湿性实验 11

2。3试验方法 11

2。3。1 单辊法制备晶态钎料 11

2。3。2 分析晶态与非晶态钎料元素差别 13

2。3。3钎料润湿性实验 13

2。3。4 用高温接触角测量仪测量非晶态与晶态的接触角 14

2。3。5 润湿面积与界面的金相观察