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[16] 田艳，红王宁，杨东升，等. 三文封装芯片键合IMC焊点应力分析及结构优化[J]. 焊接学报，2012，33(8)：17-20.
[17] 顾勇，王莎鸥，赵建明，等. 高密度3-D封装技术的应用与发展趋势[J]. 电子元件与材料，2010，29(7)：67-70.
[18] 陈贵宝，阎山. 系统级封装技术现状与发展趋势[J]. 电子工艺技术，2007，28(5)：273-276.
[19] 王毅. 高密度高性能电子封装技术的现状与发展[J]. 微电子技术，1998，26(4)：1-22.
[20] 杨艳，尹立孟，张新平. 热时效和焊点尺寸对SnAgCu微焊点强度的影响[J]. 电子元件与材料，2009(10)：54-56.
[21] 郭福. 无钎钎焊技术与应用[M]. 北京：科学出版社，2006.
[22] 杨邦朝，张经国. 多芯片组件(MCM)技术及其应用[M]. 成都：电子科技大学出版社，2001.
[23] 刘丹，钱乙余. SMT无铅焊焊膏性能的改进及其组分对性能的影响[D]. 哈尔滨：哈尔滨工业大学，2006.
[24] 蔡进洁. 几何参数变异对无铅覆晶封装温度循环测试之影响[D]. 台湾：国立中山大学，2007.
[25] 盛重. QFP焊点可靠性研究及其热循环疲劳寿命预测[D]. 南京：南京航空航天大学，2010.
[26] Zhang L, Sun L, Guo Y H, et al. Reliability of lead-free solder joints in CSP device under thermal cycling[J]. Journal of Materials Science: Materials in Electronics 2014, 25(3): 1209-1213.
[27] Wang T H, Lai Y S, Wu J D. Materal properties of thermal cycling fatigue reliability of flip-chip ball grid array[J]. Journal of Electronic Packaging, 2004, 126(4): 560-564.
[28] Morgan B, Hua X F, Iguchi T, et al. Substrate interconnect technologies for 3D MEMS packaging[J]. Microelectronic Engineering, 2005, 81(1): 106-116.
[29] Chang B J, Wang L, Drink J, et al. Finite element modeling predicts the effects of voids on thermal shock reliability and thermal resistance of power device[J]. Welding Journal, 2006, 85(5): 63-70.
[30] Park S B, Dhakal R, Lehman L, et al. Measurement of deformations in SnAgCu solder interconnects under in situ thermal loading[J]. Acta Materialia, 2007, 55: 3253-3260.
[31] Fan X J, Varia B, Han Q. Design and optimization of therm-mechanical reliability in water level packaging[J]. Microelectronics Reliability, 2010, 50(4): 536-546.
[32] Chen K M. Lead-free solder materials and chip thickness impact on board-level reliability for low-K WLCSP[J]. IEEE Transactions on Advanced Packaging, 2010, 33(2): 340-347.
[33] Ha S S, Kim J W, Ha S O, et al. Shear parameters for brittle fracture of flip chip solder joint[J]. Materials Science and Technology, 2011, 27(3): 696-701.
[34] Wilde J, Zukowski E. Predictive models for PBGA and QFN reliability estimation[C] // Conference on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems. Freiburg in Breisgau, Germany, 2008, 1-9.
[35] Hsu H C, Lee H Y, Hsu Y C. A novel submodeling scheme on thermal cycle test for CMOS Image sensor[C] // International Conference on Electronics Packaging Technology. Shanghai, China, 2006, 1-5.
[36] Syed A. Accumulated creep strain and energy density based thermal fatigue life prediction models for SnAgCu solder joints[C] // Proceeding of 54th Electronic Components and Technology Conference. Las Vegas, NV, 2004, 737-746.