摘要随着激光技术和信息与电子产业的飞速发展，近年来，激光与半导体材料的相互作用的研究成为相关领域的焦点。当半导体材料受到激光辐照时，靶材吸收激光能量，在靶材内形成一个温度场。由于靶材温度不均匀分布，低温区限制高温区的热膨胀，从而产生热应力场，导致材料的损伤形变。本文针对连续光纤激光致单晶硅熔融损伤机理进行数值模拟，并在弹塑性力学和经典传热学理论基础上，利用有限元方法建立连续激光致单晶硅热应力损伤的二文轴对称物理模型。通过COMSOL Multiphysics软件模拟了连续激光辐照下不同时刻硅片表面温度场和应力场分布，分析了激光辐照下硅表面熔融毁伤情况。最后通过实验对数值模拟进行验证，并将实验结果与数值模拟相结合，分析了熔融毁伤形貌产生的原理和特征。33647
关键词 连续激光 单晶硅 温度场 应力场 有限元 毁伤形貌
毕业论文设计论文外文摘要
Title Study on the damage morphology of monocrystal silicon melted by continuous wave fiber laser
Abstract
In recent years,with the development of laser technology and the industry of information and electronics,the interaction between laser and semiconductor materials has become the focus of the field.Semiconductor material is under laser irradiation,the target absorb laser energy and form a temperature field .Due to the non-uniform temperature distribution of target, low temperature region limits the thermal expansion in high temperature region, thermal stress arises and leads to the damage deformation of material.In this paper, a numerical simulation of the damage mechanism of single crystal silicon caused by continuous fiber laser is carried out,and based on the theory of elastic-plastic mechanics and classical heat transfer,a two dimensional axisymmetric physical model of thermal stress damage of single crystal silicon was established by using the finite element method.With the help of COMSOL Multiphysics software,the damage of the silicon surface under laser irradiation is analyzed,the surface temperature field and the stress distribution of the silicon wafer were simulated.In the end,we verify the numerical simulation through the experiment,analyze the principles and features of the damage morphology of the molten damage with the combination of the experimental results and numerical simulation .
Keywords continuous laser monocrystal silicon tempratrue field stress field finite element method damage morphology
目次
1 绪论 1
1.1 课题相关背景及研究意义 1
1.2 国内外激光与物质相互作用研究进展 2
1.3 本课题研究的主要内容 4
1.4 小结 4
2 有限元原理及激光辐照靶材温度场及热应力场的有限元解法 4
2.1 有限元方法概述 4
2.2 激光辐照硅材料的温度场和热应力场的有限元分析 7
2.3 小结 10
3 连续光纤激光辐照单晶硅的数值模拟 10
3.1 有限元法计算 10
3.2 数值模拟过程中的温度场和应力场分析 13
3.3 小结 17
4 连续光纤激光辐照单晶硅片熔融毁伤形貌研究 17
4.1 实验装置 17
4.2 实验过程中硅的熔融毁伤形貌 18
4.3 小结 19
5 总结与展望 19
5.1 总结 19
5.2 展望 21
致 谢 22
参考文献23
1 绪论
1.1 课题相关背景及研究意义
激光诞生于1960年，由于激光较之传统光源具有方向性好、亮度高和相干性好等优点，激光技术得到不断的发展改良，随后固体激光器、气体激光器、染料激光器、离子激光器和半导体激光器等[1]被相继研制出来，从而得到了广泛的认可和应用，在激光加工、激光武器、激光医疗、惯性约束核聚变、光学信息存储和处理、光通讯、遥感与测距、激光冷却和生物医学检测等领域取得了良好的社会和经济效益[2]，并表现出极大的发展潜力。 连续光纤激光致单晶硅熔融毁伤研究:http://www.youerw.com/wuli/lunwen_30854.html