SnAgCu钎料无铅焊点中锡须生长现象研究

摘要随着微电子封装技术的快速发展及无铅化进程的推进，传统SnPb钎料已不能满足如今绿色环保的要求，因此无铅钎料的研发成为了研究热点。然而无铅钎料中由于Sn含量较高，可能诱发锡须生长现象，对电子元器件产生极大的危害，严重影响元器件的可靠性。由于锡须的生长机制仍然没有定论，寻求抑制锡须生长的方法一直是亟待解决的难题。87857

本论文以SnAgCu钎料为研究对象，采用润湿平衡法研究了稀土元素Pr的添加对SnAgCu钎料润湿性能的影响，分析了Pr元素对钎料微观组织的作用机制，并通过时效试验研究了钎料中的锡须生长的现象，研究了锡须生长与稀土含量之间的关联性以及稀土元素的存在形式及作用机理；同时对影响锡须生长的相关因素进行了分析，着重研究了时效时间与时效温度对锡须生长的影响规律，为最终找到抑制锡须的方法提供理论和数据支撑。

毕业论文关键词锡须稀土元素时效温度时效时间生长机制

毕业设计说明书外文摘要

Title The study on tin whisker growth phenomenon in lead-free solder

Abstract With the rapid development of microelectronics packaging technology，traditional SnPb solder can not meet the requirements of green manufacturing and environmental protection now，thus the lead-free solder has become a research hotspot。However,the high Sn content in the lead-free solder may lead to tin whisker growth phenomenon,which will be extremly harmful to the electronic components。Moreover, the mechanism of the tin whisker growth is still not settled yet,seeking inhibition of tin whisker has always been an urgent issue。

This paper focus on the properties of SnAgCu solder,used the wetting balance method to study the addition of rare earth Pr to SnAgCu solder wettability,analyzed the elements on the microstructure of solder Pr mechanism。Through the aging test studied tin whisker growth phenomenon in the solder,also studied the connection between Tin whisker growth and the content of rare earth,and the existence form and action mechanism of rare earth。Analyzed the affecting factors of Tin whisker growth,Focused on studing the influence of aging time and aging temperature on Tin whisker growth,provide theoretical and data support to find a way to inhibit the tin whisker。源-于,优Y尔-论,文.网wwW.yOueRw.com 原文+QQ752018,766

Keywords Tin whisker growth rare earth aging temperature

aging time growth mechanism

1 绪论 1

1。1 引言 1

1。2 无铅钎料的研究现状 1

1。3 无铅钎料的可靠性问题：锡须生长现象 2

1。4 锡须的生长特点 3

1。5 锡须生长机制的研究 4

1。5。1 位错机制 4

1。5。2 再结晶机制 4

1。5。3 表面松弛机制 4

1。6 影响锡须生长的因素 5

1。7 抑制锡须生长的方法 6

2 试验方法 8

2。1 钎料制备 8

2。2 润湿性能测试 8

2。3 显微组织分析 SnAgCu钎料无铅焊点中锡须生长现象研究:http://www.youerw.com/cailiao/lunwen_148335.html