电铸铜箔微胀形成形性能研究

摘要随着制造领域不断向微型化推进，微型零件的需求日益增加。微气压胀形作为微成形技术之一，成形精度高、少无回弹、可一次成形复杂零件，受到越来越多关注。本文采用双脉冲电流制备的铜箔作为微气压胀形原材料，首先研究电铸铜箔各位置内应力、组织和拉伸性能差异，后采用正交试验法研究胀形温度、压力和热处理工艺对极限胀形高度的影响以获得最优参数。研究表明：本论文采用双脉冲电流制备的铜箔各位置内应力差异显著而组织基本相同。电铸铜箔纯度高，抗拉强度高于现有文献报导。热处理工艺对极限胀形高度影响最大，不经过热处理的原始组织晶粒细小，胀形高度最高。最优工艺为不经过热处理、胀形温度 450℃、压力2.4MPa。42529
毕业论文关键词电铸铜箔微气压胀形正交试验Title Micro bulging test of electroformed copper foil
Abstract With the advancing miniaturization manufacturing, the demand for micro parts growsgradually. Pneumatic bulge forming, one of the micro forming technology, has highforming precision, little or no springback, the ability of singly formingcomplicated shaped parts. Thus Pneumatic bulge forming has drawn more and moreattention. In this paper, we used double-pulse current to electroform copper foils.We first studied internal stress, microstructure and tensile property in differentposition of the copper foil. The effects of temperature, pressure and thermaltreatment on the ultimate height of bluging had been studied using orthogonalexperiment in order to obtain the optimal parameter. The results indicated that,copper foil electroformed by double-pulse current had significant differentinternal stress in different position, while the microstructure was basically thesame. Electroforming copper foil had high purity, and its tensile strength washigher than available literatures. Thermal treatment had the most importantinfluence on the ultimate bulging height, copper foil with original microstructurehad the max bulging height. The optimal parameter, without thermal treatment, 450℃bulging temperature, 2.4 MPa pressure was obtained in the experiment.
Keywords Electroformed copper foil; micro bulging test; orthogonal experiment

1绪论1

1.1微成形简介1

1.2微胀形工艺及研究现状1

1.3电铸铜简介2

1.4研究的意义3

1.5主要研究内容3

2实验材料及方法5

2.1实验材料及参数的选择5

2.2实验方法6

3电铸铜箔各向异性··12

3.1电铸铜箔内应力的位置效应··12

3.2电铸铜箔微观组织的位置效应··14

3.3电铸铜箔拉伸性能的位置效应··15

3.4本章小结··19

4胀形参数对电铸铜箔胀形性能影响··21

4.1胀形参数摸索··21

4.2胀形参数对极限胀形高度的影响··23

4.3本章小结··28

结论30

致谢31

参考文献32

附录A科研成果·35
1 绪论随着制造领域不断向微型化发展，微型零件的需求日益增加，微成形技术备受关注[1]。微气压胀形技术是微成形技术的一种，少无回弹、成形精度高、可一次成形复杂零件，在微型零件的规模化生产中有显著的优势[2]。铜箔成形性能优良，在覆铜板（CCL）和挠性电路板（PCB）等电子领域有广泛应用，因此其微胀形成形研究具有重要的应用价值[3-4]。铜箔按制造工艺可分为压延铜箔和电解铜箔。压延铜箔由轧制而得，工艺成熟，但是制造成本高，极限厚度受设备限制，表面粗糙度大[5]。而电解铜箔通过电解方法制得，可以通过改变电解工艺中的温度、电流密度、电镀液成分等改善铜箔的性能[6-7]。同时电解铜箔工艺不断发展，已经成功通过脉冲电流制备出高质量的纳米晶铜[8]。从而，用脉冲电流制备铜箔，并进行微气压胀形工艺研究，对于发展微成形技术具有重要的理论意义和实用价值。电铸铜箔微胀形成形性能研究:http://www.youerw.com/cailiao/lunwen_43024.html