毕业论文移动版

摘要根据统计，55%的电子设备失效是温度过高引起的。可见电子设备的主要故障形式为过热损坏，因此对电子设备进行有效的散热是提高产品稳定性的关键。针对电源盒散热问题，本文从静态分析和热分析两个方面对电源盒的相关部件展开了研究。48789

    本论文在对相关散热部件进行三维建模的基础上，运用SolidWorks Simulation 软件对三维模型实现静态应力分析和热分析。

本文对散热片的优化过程实际上是一系列的前处理－求解－后处理－优化的循环过程。在满足散热空间约束的前提下，以使散热片中的最高温度值最小化为目标，运用控制变量法对散热片结构参数进行优化设计。并且在装配时使散热底板和散热片能够更好的接触，以减小热阻。通过这些措施达到提升散热片散热性能的目的。

    通过上述方法，本文实现了提升电源盒散热效果的目的。通过优化后的三维模型建立二维图。最后，对全文进行了总结，并对后续的研究工作提出了一些建议。

毕业论文关键词：优化设计； 散热片； 静态分析； 热力分析

Abstract According to statistics, 55% of electronic equipment failure were caused by high temperature.we can see that the main failure form of electronic equipment is overheating damage,therefore effective heat dissipation for electronic equipment is the key to improve the stability  of the product .To focus on the heat  dissipation problem of the power box, we launched a study of static analysis and thermal analysis,for the related components of the power supply box. 

This thesis is based on three-dimensional modeling for the  related cooling components, we use  SolidWorks Simulation software for 3D model to expand the study of static stress analysis and thermal analysis. static stress analysis and thermal analysis.

The optimization process of heat sinks is a circular process of pre-solution, solving and post treatment. On the premise of satisfying the constraint of cooling space, the maximum temperature of heat sinks is minimized.we use control variables method to optimize the structural parameters of the cooling sink. And the cooling base plate and heat sink assembly to make bettercontact in order to reduce the thermal resistance. We through these measures to enhance the performance of cooling sink .

Through this method, the purpose to enhance the cooling effect of the power supply box. Optimized three-dimensional model, the establishment of two-dimensionaldiagram. Finally, the conclusion of this thesis and the advices forfuture research are given.

Keywords：optimization design； heat sink； static analysis； thermal analysis

目 录

第一章 绪论 1

1.1抽屉式电源盒介绍 1

1.2相关技术与研究现状 1

1.2.1 CAE（计算机辅助分析）介绍： 1

1.2.2 电子产品的散热方法介绍 2

1.3本文的主要工作 3

第二章 SolidWorks Simulation 的应用分析 4

2.1 有限元分析概述 4

2.2建立数学模型 5

2.3 建立有限元模型 6

2.4 求解有限元模型 6

2.5 结果分析 6

2.6 SolidWorks Simulation 对模型进行分析的关键步骤 7

2.7运用 SolidWorks Simulation 静态分析需要考虑的因素 (责任编辑：qin)