摘要随着电子元件微型化的飞速发展，其散热条件也变得越来越苛刻，因而均温板技 术逐渐被大家所重视。均温板技术就是通过液体工质的相变潜热换热，将电子设备运 行所产生的热量迅速高效地均匀分散开，在均温板上表面形成一个相对均匀的温度 场，从而降低电子设备的运行温度。当前市面上的均温板种类比较单一，在性能方面 还有较大的提升空间。设计出热阻更小、性能更好的均温板，对于未来电子器件散热 领域的发展会有很大的帮助。本课题对沟槽式均温板的制作过程进行了探索，改变均 温板内部毛细芯结构以及充注量等影响其性能的因素，根据实验数据结果对比分析出 性能相对更好的内部结构及工质的充注量。81247

本课题的主要工作是对影响沟槽式均温板性能的结构因素进行探索。设计出本课 题实验所需的均温板结构并利用 CNC 机械加工的方式制作出上下盖板，然后进行沟槽 式均温板的制作过程：首先对均温板上下盖板及毛细芯结构进行清洗；然后利用中温 锡膏烧结充注管及毛细芯结构；再通过密封圈和螺栓结合的方式组装上下盖板及保证 腔体的密封性；最后采用电子充注系统充注工质液体并抽真空和密封，完成均温板的 制作过程。

然后组建起相对完善的性能测试系统，对制作出来的沟槽式均温板进行测试。通 过分析对比实验所测的数据可以发现，深宽比为 1。2 的槽道散热性能优于深宽比为 2槽道的散热性能，说明深宽比为 1。2 的槽道其毛细力更强，性能更好；在相同深宽比 下，60 槽均温板的散热性能比 48 槽均温板更好，说明槽数越密集其吸液性越强，传 热性能更好；对比充液量分别为 3ml 和 5ml 的同一沟槽，发现充液量为 3ml（充液率 73。2%）均温板传热性能比充 5ml（充液率为 122%）时的性能更好，说明充注量过多 会影响均温板腔内的工作循环，从而影响均温板的整体性能。在测试均温板的启动特 性时，分析对比试验所得数据可以发现 60 槽均温板的启动性能也比 48 槽均温板更好， 这也得益于更多的槽道。此外，在下板中心区域烧结一小块泡沫铜也有助于均温板的 启动，主要是由于泡沫铜增大了中心区域的毛细力。

毕业论文关键字：均温板、性能测试、热阻

Abstract With the rapid development of electronic device miniaturization,  its  cooling conditions is also becoming more and more strict, so many people attach importance to the Vapor chamber technology。 Vapor chamber technology is through the liquid working medium of the phase change latent heat, the heat generated by the electronic equipment running quickly and efficiently evenly spread out, on the mean temperature board surface to form a relatively uniform temperature field, so as to reduce the operating temperature of the electronic equipment。 Currently on the market the Vapor chamber type is unitary, in terms of performance and a large room to improve。 Design a piece of thermal resistance smaller, better performance, heat transfer limit larger plate are temperature, for the future development in the field of electronic device cooling will provide great help。 This topic on the groove explores the process of temperature, plate, the change in temperature plate filled volume of the internal capillary core structure and factors affecting its performance, such as according to the results of the experimental data contrast analysis of the performance is relatively better filled volume of the internal structure and the working medium。

This topic main job is to structure factors influencing the performances of the groove are panels to explore。 To design the mean temperature of this topic experiment board structure and use of CNC machining method to produce top and bottom cover plate, and then to the groove are temperature plate production process: first of all, to  mean temperature board up and down cover plate and capillary core structure for cleaning; Then using Wen Xi paste sintering of filling pipe and capillary wick structure; Then assembled by means of sealing ring and bolt combined with upper and lower cover plate and ensures that the cavity sealing; Finally using electronic filling system liquid and vacuum filling and sealing, complete all the making process of the panels。