聚合物IC封装元件的应力及翘曲研究

摘要随着现代化进程的逐步深入，电子行业对于 IC 技术的发展有着越来越高的要求。IC 的发展中，封装技术的发展也是非常重要的，IC 封装不仅要求封装材料具有优良的导电性能、导热性能以及机械性能，还要求具有高可靠性、低成本和环保性，因此随着半导体元件逐渐向轻小薄短发展的趋势，对于 IC 封装的翘曲和残余应力的变化的问题也逐渐收到越来越多的重视。此次研究的课题就是在基于不同材料性质的本身对于 IC 封装的影响和封装过程中不同变量参数的选择，除材料之外，生产参数也会对翘曲量和残余应力的大小造成影响，例如不同的模温，保压压力等，通过使用最新的 Autodesk Simulation Moldflow Synergy 2015，运用软件自带的对于溶体流道的分析，来检验不同情况下 IC 封装元件的应力变换情况和翘曲量。同时通过 Moldflow 内置的最新的 P-V-C-T 方程式，对于翘曲量的分析会比单纯的参考热膨胀系数更为准确，从实验结果我们也可以看出，当模具的固化压力增大时，模具的翘曲量也会随之增大，而当温度越高时，翘曲量随之降低。78078

毕业论文关键词：IC 封装；翘曲；残余应力；Moldflow。

Abstract With the deepening of the process of modernization, the electronics industry for the development of IC technology has increasing demands。 IC development, the development of packaging technology is also very important, IC packaging requires not only packaging material has excellent electrical conductivity, thermal conductivity and mechanical properties, but also requires a high reliability, low cost and environmental protection, so as the semiconductor element light gradually trend to develop small thin short, the problem for warping and residual stress changes in IC package also gradually received more and more attention。 The subject of study is based on the nature of the selection of different materials and the packaging process itself for the impact of different variables IC package parameters, in addition to materials, production parameters will affect the amount of warpage and size of residual stress, for example, different mold temperature, holding pressure, etc。, by using the latest Autodesk Simulation Moldflow Synergy 2015, the use of the melt flow path analysis software comes to transform stress test conditions and the amount of warpage in different situations IC packaging components。 At the same time through the built-in Moldflow latest PVCT equation, the amount of warpage analysis will be more accurate than a simple reference coefficient of thermal expansion, from the experimental results we can see, when cured mold pressure is increased, the amount of warpage of the mold also increases, and when the temperature is higher, the amount of warpage decreases。

Keywords: IC package; warping; residual stresses; moldflow。

第一章绪论 1

1。1 IC 封装的简介 1

1。2 IC 封装元件的发展及巨大作用 4

1。3 IC 封装的应力和翘曲问题 6

1。4 最新的 IC 封装技术 7

1。5 研究的目的和意义 7

第二章理论分析 8

2。1 Moldflow 软件的功能及介绍 8

2。2 模流的填充和分析 9

2。3 固化反应动力模式及 P-V-C-T 状态方程式 10

2。4 应力应变统制方程式 11

第三章不同材料的实验分析聚合物IC封装元件的应力及翘曲研究:http://www.youerw.com/jixie/lunwen_89894.html