MEMS中某硅膜片的热力耦合分析和优化设计
毕业论文关键词：ansys workbench 有限元 MEMS 硅膜片 优化分析 热力耦合28694
Title Thermo mechanical analysis and optimal design of a silicon diaphragm in MEMS Optimization analysis
Abstract
The MEMS pressure sensor is made from the effect of the silicon pressure.. One of the disadvantages of pressure sensor is that it has a strong temperature sensitivity, and the temperature can have a significant impact on the output signal.. Lead to pressure sensor distortion. The research task of this paper is to optimize the design of a silicon in a MEMS.. Through the proe software to establish a sensor of a quarter model and using ANSYS Workbench established finite element model, thermal coupling analysis, by changing the temperature loads of the silicon diaphragm, the study of temperature change is how to affect the output signal of the sensor. Taking into account the sensor glass layer thickness may also the output signal distortion effects, by changing the thickness of the layer of glass, compared the different glass layer of the sensor output signal distortion. At the same time, the material of the substrate can also affect the distortion of the signal, and this paper also tries to change the material of the substrate, and then study which material is more suitable as the substrate material of the sensor. Through the above analysis, this paper puts forward valuable suggestions for the optimization design of the pressure sensor in MEMS.
Keywords： ANSYS workbench MEMS finite element thermal analysis Optimization analysis Thermal coupling
目录
第一章 绪论 1
I. MEMS简介 1
MEMS制造的材料 1
理查德费曼MEMS制造技术 2
应用程序 3
mems产业结构 4
II. 压阻效应简介 4
压阻效应的机制 4
压敏电阻硅设备 5
III. 压阻传感器的优劣 5
IV. 本论文的主要研究内容 5
论文任务 6
第二章 MEMS压力传感器工作原理 7
压力传感器的输出信号【9】 7
在装配过程中，压力传感器的热行为【11】 7
第三章 硅膜片的有限元分析 10
I. ansys 软件简介【15】 10
II. ANSYS Workbench平台及模块 10
III. ANSYS Workbench平台及模块 13
IV. 结果与分析 20
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