[17]卢斌,栗慧，王娟辉等．添加微量稀土元素对 SnAgCu 系无铅焊料性能的影响[J]．稀有 金属与硬质合金，2007，35(1)：27-30．

[18] Yoon J W,Lee Y H，Kim D G et a1．Intermetallic compounds layer growth at the interface between Sn-Cu-Ni solder and Cu substrate[J]．Journal of Alloys and Compounds，2004，381： 51-157．

[19] 韩宗杰，鞠金龙，薛松柏．半导体激光软钎焊 Sn-Ag—Cu 焊点微观组织[J]．中南大学 学报：自然科学版，2006，37(2)：229-234．

[20] Wu C M L，Yu D Q，Law C M T,et a1．Properties of lead-free solder alloys with rare earth element additions[J]．Mater Sci Eng，2004,44：1-44．

[21]Li B, Shi Y W, Lei Y P , et al。 Effect of rare earth element addition on the microstructure of SnAgCu solder joint[J]。Journal of    Electronic Materials,2005,34:211-224。

[22]Hao H, Tian J, Shi Y W, et al。 Properties of Sn3。8Ag0。7Cu solder alloy with rare earth Y element additions[J]。Journal of Electronic Materials,2007,36:766-774

[23]胡赓祥，蔡珣，戎咏华。材料科学基础（第三版）[M]。上海:上海交通大学出版社，2010。

[24]MA X ,QIAN Y Y ,YOSHIDA F。 Effect of La on the Sn-rich halo formation in Sn60Pb40 alloy[J]。Journal of Alloys and Compounds , 2001,327(1/2):263-266。

[25] Suganuma K。 Advances in lead-free electronics soldering。 Current Opinion in Solid State and Materials science, 2001, 5(1): 55~64。

[26] Zeng K, Tu K N。 Six cases of reliability study of Pb-free solder joints in electronic packaging technology。 Materials Science and Engineering: R, 2002, 38(2): 55~105。

[27] Anderson I E, Cook B A, Harringa J L。 Sn-Ag-Cu Solders and Solder Joints Alloy development[J]。 Microstructure and Properties, 2000, 29(10): 214-221。

[28] Anderson   I   E,   Cook   B   A,    Harringa    J    L,    et    al。    Sn-Ag-Cu    Solder    and Solder    Joints   Alloy Development[J]。 Microstructure and Properties，2000，29(10): 214-221。

[29] Michael C, Gupta Garner Vivek, Bissessur Vivek。 Challenges in converting to ead-free electronics Electronic Packaging Technology Conference[C]。 Singapore: Concentration Banking Info, 2000。 6-9。

[30] Chada S, Fournelle R A, Laub W, et al。 Copper Substrate Dissolution in Eutectic  Sn-Ag Solder and Its Effect on Microstructure[J]。 Journal of Electronic Materials, 2000, 29(10): 1214-1221。

[31] LAW C M T, WU C M L, Yu D Q, et。al。 Microstructure, Solderability, and Growth of Intermetallic Compounds of Sn-Ag-Cu-RE Lead-Free Solder Alloys[J]。Journal of Electronic Materials,2006,35(1):89-93。

[32] Yu D Q, Zhao J, Wang L。 Improvement on the microstructure stability,  mechanical and wetting Ndoperties of Sn-Ag-Cu lead-free solder with the addition of rare  earth elements[J]。Journal of Alloys and Compounds, 2004,376(1-2):170-175。

[33] Lewis D, Allen S, Notis M, et。al。 Determination of the Eutectic Structure in the Ag-Cu-Sn system    [J]。Journal of lectronic Mateials, 2002, 31(2):161-167。