摘要本次论文主要是研究SnPb和SnAgCu这两种钎料之间组织与性能的对比研究，众所周知SnPb作为传统焊料，它的成本比较低廉、熔点低、延展性和润湿性比较良好，因此被使用在电子封装工业中，无论从环境角度还是性能方面已经不再是热门焊料了，现在基本已经没人使用了。80318
SnAgCu焊料因为本身的力学性能比较好，所以取而代之是SnAgCu这种无铅焊料，所以无铅焊料成为了专家学者研究的热门钎料了。本篇论文通过对比分析了SnPb和SnAgCu两种无铅钎料的润湿性及力学性能，还有高温时效0-500小时两种焊料的焊点显微组织。结果表明：通过ImageJ软件计算两种焊料的铺展面积发现，在润湿性方面和铺展性能SnPb焊料明显的优越于SnAgCu焊料，然而SnAgCu的力学性能比较良好，是优越于SnPb的，在时效处理中，在温度为150 ℃情况下分为100h、200h、300h、400h、500h的五次时效处理，发现金属间化合物的厚度随着时效处理时间的依次增加而逐渐变厚。
毕业论文关键词：SnPb SnAgCu 湿润性能 显微组织 金属间化合物
Comparative study on Microstructure and properties of SnAgCu/SnPb solder joints
ABSTRACT This paper is mainly contrast research of the microstructure and properties of SnPb and SnAgCu both between the filler metal, known as SnPb as traditional solder, its relatively low cost, low melting point, ductility and wettability relatively good, is thus used in the electronic packaging industry, both from the environmental point of view or performance is no longer hot solder, now has been out of use。
SnAgCu solder because of its good mechanical properties, so instead of SnAgCu lead-free solder, lead-free solder has become a hot solder of the experts and scholars。 In this paper, the wettability and mechanical properties of SnPb and SnAgCu two kinds of lead-free solder are compared and analyzed, and the microstructure of solder joint of two kinds of 0-500 hours at high temperature aging is also analyzed。 Results show that: by ImageJ software calculated the spreading area of two solder found in wetting and spreading properties of SnPb solder was superior in SnAgCu solder。 However, the mechanical properties of SnAgCu relatively good is superior to SnPb, in aging treatment, at a temperature to 150 DEG C under 100h, 200h, 300h, 400h, 500h six times of aging treatment, intermetallic compound thickness with aging time, which in turn increases and becomes thick。 In this experiment, there are deficiencies, but also hope that professionals and teachers to correct。
Key words:SnPb SnAgCu Wetting properties Microstructure Intermetallic Compounds
目 录
摘 要 Ⅰ
Abstract Ⅱ
目 录 IⅢ
图清单 Ⅳ
图清单 Ⅳ
1 绪论 1
1。1 钎料的发展历程 1
1。2 锡铅钎料的应用 1
1。3 无铅钎料的提出背景 2
1。4 无铅钎料存在的问题 9
1。5 无铅钎料的发展趋势 9
1。6 改善无铅钎料性能的方法 ……………11
1。7 本章小结 ……………12
2 实验过程 13
2。1 实验材料的准备 SnAgCu/SnPb焊点组织与性能对比研究:http://www.youerw.com/zidonghua/lunwen_93247.html