CAE笔记本电脑后盖浇注系统优化设计_毕业论文

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CAE笔记本电脑后盖浇注系统优化设计

摘要随着塑料制品在家电、汽车等高新技术领域的使用不断拓宽、延伸,塑料制件的质 量、性能被赋予了更高的要求。而注塑成型技术是最普遍的塑料加工方法之一,因此对 于注塑模的设计要求也就随之增高。以试模法为代表的传统模具设计方法已然不能满足 实际生产的需求,注塑成型 CAE 技术应运而出,并凭借其自身优势,成为模具设计不 可或缺的一部分。

本文基于 Moldflow 软件对某公司的笔记本电脑后盖制件进行充填模拟分析,通过大 量的模拟分析试验,结合正交试验以及单因素实验,以改善制件的翘曲变形量为目的, 对制件浇注系统、工艺参数进行了优化。80623

本文根据制件结构特征及浇注系统建立原则,设计了两套不同的浇注系统,通过 Moldflow 软件对不同的浇注系统进行数值模拟,通过比较其体积收缩、翘曲变形情况, 确定优化设计后的浇注系统。其次,通过正交试验、单因素实验,分析熔体温度、模具 温度、保压压力、保压时间以及注射速率对制件翘曲变形量的影响规律,确定制件的最 佳工艺参数。研究结果表明:(1)通过 Moldflow 软件对两套浇注系统进行了模拟分析比 较,H 形浇注系统相比 X 形浇注系统更有利于降低制件的翘曲变形量,提高制件的质 量;(2)在模具温度、保压压力、熔体温度以及注射速率四个工艺参数中,保压压力 对制件的收缩翘曲变形影响最为显著,其次分别为熔体温度、注射速率、模具温度;保 压时间对翘曲变化基本没有影响;笔记本电脑后盖的最佳工艺参数:模具温度控制在 25℃,熔体温度为 215℃,注射速率为 110cm3/s,保压时间为:4s,保压压力为对应注射压 力的 155%,即保压压力是 112。33MPa。以优化后的工艺参数对笔记本电脑后盖进行注 塑成型模拟,得到的翘曲变形量是 1。288mm,相比使用默认的工艺参数获得的翘曲变形 量 1。651mm,减少了 21。99%。

毕业论文关键词:注塑成型;浇注系统;工艺参数;优化设计

Abstract With the use of plastic products in home appliances, automotive and other  high-tech fields are expanding, extending,The quality and the performance of the  plastic parts,  have been given a higher requirement。 And the injection molding technology is one of the most common plastic processing methods, so the injection mold design requirements also increased。 The trying moulding method as the representative of the traditional mould design method already cannot satisfy the needs of the actual production, injection molding CAE technology should be transported and become mold design is an indispensable part by virtue of their own advantages。

based on Moldflow software to a company laptop cover parts filling simulation analysis, this paper through a lot of simulation test, combined with orthogonal test and single factor experiment, to improve the workpiece warpage for the purpose, optimizes the workpiece feed system and the process parameters 。

According to the workpiece structure features and the gating system establishment principle, this paper designs two different sets of gating system , by using Moldflow software to different gating system numerical simulation by comparing the volume shrinkage, warpage deformation, to determine the optimal design of the gating system。Secondly, through orthogonal experiment, single factor experiment, this paper analysis the part  of the  law of melt temperature, mold temperature, holding pressure, holding time and injection rate on the deformation , to determine the optimal process parameters。The results of the study show  that:

(1) Through the simulation analysis of the two sets of gating system by Moldflow software, compared with the X shaped gating system, the H shaped gating system is more advantageous to reduce the distortion of the parts and improve the quality of the parts; (2) In the mold temperature, packing pressure, melt temperature and injection rate of four process parameters, holding pressure is the most significant, followed by melt temperature, injection rate, mold temperature; guaranteed the  warpage variation did  not affect the  basic;the  optimal   process (责任编辑:qin)