摘要随着微电子技术的发展，电子元件的集成度越来越高，面对微电子器件数千瓦的发热 功率，微热管开始成为热设计中考虑的重要装置。模型忽略机载雷达电子元件高温等恶劣 环境的影响，以模型是否添加热管、不同的冷水进口温度为变量，且仅对每一个发热模块 中最大的发热面添加热管，设计四组工况进行探究。79497

分析仿真数据得知在机箱内部添加热管装置，可以加速发热面的热量转移，降低发热 面的工作温度。冷液进出口温度差提高近 13。5%，但进口温度提高为 318K 时，冷管的散热 影响不再显著，此时可以通过增加热管装置的数量及体积的方法促进换热。通过查阅相关 文献，发现模型进出口温差与相关文献中的进出口温度实验数据量级相符，这进一步验证 了模型的可信度。

毕业论文关键词 微电子 热管 热设计 仿真

毕 业 设 计 说 明 书 外 文 摘 要

Title The study of the thermal performance of a plate heat pipe to a uniform heating device

Abstract With the development of microelectronic technology, the integration of the electronic components are becoming increasingly high 。 Faced with the several kilowatts of heat power of the microelectronic devices ,micro heat pipe has become an important device for thermal design 。 We ignore the influence of the high temperature and other harsh environment of airborne radar electronic components 。 we design four sets of conditions to explore the influence with heat pipe and different water-liquid inlet temperature as variable and We only add the heat pipe to the biggest heating surface in the model 。

With the simulation data ,we find that the heat pipe can accelerate the heat transfer from the heating surface and reduce the temperature of heat surface 。The temperature difference between inlet and outlet of the cold liquid is increased by nearly 13。5%, but when the inlet temperature is increased to 318K, the cooling effect of the cooling tube is no longer significant ,and the heat transfer can be promoted by increasing the number and volume of the heat pipe device。 By consulting the relevant literature, it is found that the temperature difference between the inlet and outlet temperature of the model is consistent with the experimental data of the relevant literature, which further verifies the credibility of the model。

Keywords  microelectronic  heat pipe  thermal design simulation

本科毕业设计说明书 第 I 页

目 次

1 绪论 1

1。1 课题背景 1

1。2 研究现状 1

1。3 课题介绍 3

2 机箱换热原理 4

2。1 引言 4

2。2 热管换热 5

2。3 水冷板换热 5

3 几何模型设计 7

3。1 引言 7

3。2 机型模型介绍 7

3。3 建立简化模型