摘要随着人类科技的不断发展以及对电子的要求越来越高，电子产品朝着体积小, 重量轻的方向发展，出现了很多不同的封装结构。晶圆级芯片封装（WLCSP） 是现在最先进的封装形式之一，它就具有体积小、重量轻、成本低廉等优点。73980
本文采用 ANSYS 有限元分析，对 WLCSP 无铅焊点热应力应变问题进行了 有限元分析。我们利用 ANSYS 软件建立了晶圆级芯片封装模型。根据 Generalized Garofalo（Secondary）稳态模型的本构方程，利用焊点疲劳寿命方程预测焊点的 疲劳寿命。
在本文中，我们还从焊点尺寸大小和焊点材料这两方面对焊点进行蠕变应变 的模拟分析。研究的结果表明：无论条件如何发生变化，焊点的上表面始终是应 力应变发生的集中处，集中表现为焊点出现裂缝，从而导致失效。
毕业论文关键词：晶圆级芯片封装 有限元 疲劳寿命 焊点
Finite element analysis of thermal stress and strain of WLCSP lead free solder joint
Abstract With the continuous development of human science and technology, more and more high to the requirement of electronic products, electronic products in small volume, light weight in the direction of development, there are many different encapsulation structure。 Wafer level chip packaging (WLCSP) is now one of the most advanced form of encapsulation, it has the advantages of small volume, light weight and low cost。
This article uses the ANSYS finite element analysis, the WLCSP lead-free
solder heat stress and strain finite element analysis。 We use ANSYS software
to establish the model of the wafer level chip packages。 According to the Ge neralized Garofalo (Secondary) constitutive equation of steady state model, usin g the solder joint fatigue life equation to predict the fatigue life of solder joint s。
In this article, we also from the spot size and solder material both creep strain simulation analysis was carried out on the spot。 Research results show th at whatever conditions change, solder joint is always on the upper surface of s tress and strain concentration, concentration of solder joint crack, resulting in f ailure。
Key Words: wafer level chip packaging Finite element The fatigue life solder joints
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摘 要 。。。。Ⅰ
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1 绪论 1
1。1 集成电路封装的发展 1
1。2 晶圆级封装技术的分类 6
1。3 晶圆级芯片尺寸封装及其可靠性 7
1。5 本文的研究内容和意义 WLCSP器件无铅焊点热应力应变有限元分析:http://www.youerw.com/jixie/lunwen_84435.html